We’re heading to Phoenix! ✈️
NxQ is excited to exhibit at the 2026 IMAPS Device Packaging Conference —the premier event for microelectronics and advanced packaging.
📍 Booth #208
🗓️ March 2–5, 2026 | Sheraton Grand at Wild Horse Pass, Phoenix, AZ
Why This Event Matters:
The Device Packaging Conference brings together the brightest minds in semiconductor packaging—from emerging technologies to high-volume manufacturing. With a robust 4-track technical program, professional development courses, and unmatched networking opportunities, this is where the future of advanced packaging takes shape.
Come find NxQ at Booth 208 to:
• Discuss custom-engineered mask aligner and photolithography solutions for advanced packaging applications
• Explore how our systems support fan-out wafer-level packaging, hybrid bonding, and advanced substrates
• Connect with our applications specialists to optimize your process for precision and throughput
• Learn how we support R&D, pilot lines, and full-scale production with scalable, cost-effective equipment
Why NxQ?
For over 35 years, NxQ has been the premier supplier of contact/proximity mask aligners. We don’t just build equipment—we partner with you to solve complex packaging challenges and accelerate time-to-market.
Let’s connect in Arizona.
Booth 208 – See you there!
