NxQ 8000 Series – Scalable, high volume production platform

The NxQ 8000 Production Mask Aligner Integrates the latest in Robotic Automation with a state of the art next generation design from Milara, Inc.

The Dual Arm Robot delivers lightning fast wafer transfer at twice the accuracy of competitors and incorporates a pre-aligner from Logosol which can detect transparent substrates making it ideal for not only silicon, but a wide range of compound semiconductor materials. It is a WTS combination that is by far the best in the industry.

The NxQ 8000 Alignment Stage utilizes the latest in linear motion technology. With encoder feedback loops measuring actual stage position (not motor position), the vision system is not limited by the hardware, allowing for alignment accuracies of less than 0.5um 3 sigma. This accuracy is achieved using our Quadcam Microscope with 5x objectives, delivering an ideal combination of magnification, field of view and depth of focus.

The NxQ 8000 Series Mask Aligner is ideal for Microelectronics, LED / HB LED, 3D IC, SIOP, WLP, 2.5D Interposer, MEMS, BioMEMS, MicroFluidics, Compound Semi, Solar (HCPV), and Optoelectronics applications.

Standard Features
  • Wafer sizes from Pieces up to 200mm diameter Manual Load, 50mm up to 200mm Robot Load
  • Standard on Auto Load Systems:
    • State of the art dual arm robot from Milara Corporation
    • Logosol Pre-Aligner – detects opaque, semitransparent and transparent wafers
    • Up to Four software configurable cassette I/O stations
    • Quadcam Microscope – Two high resolution CCD cameras per objective, switch between Wide View and High Magnification without refocusing
    • Production Enclosure
  • Windows based menu driven Graphical User Interface (GUI)
  • Fully Motorized X-Y-θ Alignment, controlled with electromagnetic linear motors
  • Automatic Alignment with Smart Align Technology
  • Motorized top and bottom microscopes with recipe stored positions
  • LED thru objective illumination with recipe stored intensity settings
  • Easy manual tray-load for loading wafers or pieces
  • Multiple contact and proximity exposure modes
Optional Features
  • Automatic Filter Insertion – Recipe Set
  • Synthetic Pattern Input
  • Integrated bar code reader
  • SECS / GEM Software
  • Optical Backside Alignment and Backside Infrared (IR)
  • Ring Illumination for oblique and dark field illumination
  • UV-LED exposure optics
  • 500 Watt / 1KW Constant Power / Constant Intensity Lamp House and power supply
  • Heated Wafer Chuck and Mask Holder
  • Automated mask changing
Technical Specifications
  • Exposure Modes: Soft, Pressure, Vacuum Contact and Proximity Printing Modes
  • Print Resolution:
    • Proximity – 3um at 20um gap
    • Soft Contact – 2um
    • Hard Contact – 1um
    • Vacuum Contact – 0.6um
  • Cycle Time and Alignment Accuracy (3 sigma)
    • First Mask Mode 130+ wph
    • TSA Auto Align Mode (Contact) +/-0.5um 110+ wph
    • TSA Auto Align Mode (Proximity) +/-0.5um 110+wph
    • BSA Auto Align Mode (Contact) +/-0.75um 100+wph
    • BSA Auto Align Mode (Proximity) +/-0.75um 100+wph
  • Substrate Size: Up to 8”, Up to 10mm thick
  • Mask Size: 3” X 3” up to 9” X 9”; Mask Adaptors are available for smaller Masks
  • Alignment Stage
    • Alignment Travel X-Y and Theta Motorized with automatic re-centering
    • X-Y Movement: +/- 4mm, 100nm resolution
    • Theta Rotation Range: +/- 7.5 degrees, 4x10e-5 resolution
    • Mask/ Wafer separation: 0 – 1000um with 1um resolution

Product Literature


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