NxQ 8000 Manual Load Mask Aligner
The NxQ 8000 ML Mask Aligner and Front to Back Overlay Inspection System integrates state-of-the-art alignment stage design. Equipped with the revolutionary UV-LED exposure optics, the printing performance is far superior to that of a mercury bulb source and lasts 7-10 years in an HVM environment. The NxQ 8000 ML alignment stage utilizes the latest in linear motion technology. With encoder feedback loops measuring actual stage position, not motor position, the vision system is not limited by the hardware, allowing for alignment accuracies of less than 0.5µm 3 sigma. This accuracy is achieved using our Quadcam Microscope with 5x objectives, delivering an ideal combination of ‘Magnification,’ ‘Field of View,’ and ‘Depth of Focus.’
The NxQ 8000 ML features a manual load system, allowing operators to load wafers or pieces efficiently without requiring robotic automation. This approach is ideal for facilities prioritizing flexibility and simplicity in their workflow.
The versatility of the NxQ 8000 ML makes it the preferred choice of manufacturing facilities and R&D Centers around the world for a wide range of technologies.
The NxQ 8000 ML Mask Aligner is ideal for Microelectronics, 3D IC, WLP, 2.5D Interposer, MEMS, and Solar (HCPV) applications.
- Wafer sizes from Pieces up to 200mm diameter Manual Load
Windows based menu driven Graphical User Interface (GUI) - Fully Motorized X-Y-θ Alignment, controlled with electromagnetic linear motors
- Automatic Alignment with Smart Align Technology
- Motorized top and bottom microscopes with recipe stored positions
- LED thru objective illumination with recipe stored intensity settings
- Easy manual tray-load for loading wafers or pieces
- Multiple contact and proximity exposure modes
- Automatic Filter Insertion – Recipe Set
- Synthetic Pattern Input
- Integrated bar code reader
- SECS / GEM Software
- Optical Backside Alignment and Backside Infrared (IR)
- Ring Illumination for oblique and dark field illumination
- UV-LED exposure optics
- 500 Watt / 1KW Constant Power / Constant Intensity Lamp House and power supply
- Heated Wafer Chuck and Mask Holder
- Automated mask changing
- Exposure Modes: Soft, Pressure, Vacuum Contact and Proximity Printing Modes
- Print Resolution:
Proximity – 3um at 20um gap
Soft Contact – 2um
Hard Contact – 1um
Vacuum Contact – 0.6um - Substrate Size: Up to 8”, Up to 10mm thick
- Mask Size: 3” X 3” up to 9” X 9”; Mask Adaptors are available for smaller Masks
- Alignment Stage
- Alignment Travel X-Y and Theta Motorized with automatic re-centering
- X-Y Movement: +/- 4mm, 100nm resolution
- Theta Rotation Range: +/- 7.5 degrees, 4x10e-5 resolution
- Mask/ Wafer separation: 0 – 1000um with 1um resolution
