NxQ 8008 Cluster Tool Series – Scalable, High Volume Production Platform
The NxQ 8008 Cluster Tool Production Mask Aligner Integrates the latest in Robotic Automation with a state of the art next generation design from Milara, Inc.
The Dual Arm Robot delivers lightning fast wafer transfer at twice the accuracy of competitors and incorporates a pre-aligner from Logosol which can detect transparent substrates making it ideal for not only silicon, but a wide range of compound semiconductor materials. It is a WTS combination that is by far the best in the industry.
The NxQ 8008 CT Mask Aligner offers industry state of art automated mask loading option with its front load port design which are SMIF load port upgradeable while maintaining the footprint of the tool.
The NxQ 8008 CT Alignment Stage utilizes the latest in linear motion technology. With encoder feedback loops measuring actual stage position (not motor position), the vision system is not limited by the hardware, allowing for alignment accuracies of less than 0.5um 3 sigma. This accuracy is achieved using our Quadcam Microscope with 5x objectives, delivering an ideal combination of magnification, field of view and depth of focus.
The NxQ 8008 CT Series Mask Aligner is ideal for Microelectronics, LED / HB LED, 3D IC, SIOP, WLP, 2.5D Interposer, MEMS, BioMEMS, MicroFluidics, Compound Semi, Solar (HCPV), and Optoelectronics applications.
- Full-field Exposure up to 200 mm Diameter
- UV-LED Broadband or I-LineExposure Source (Tuneable)
- Top Side Alignment 0.5um +/- 3 sigma
- Backside Alignment 0.75um +/- 3 sigma
- Manual or Automatic Operation
- Extremely Small Cleanroom Footprint
- Suitable for R&D, Pilot or HVM
- Alignment Stage utilizes the latest in linear motion technology with encoder
feedback measuring actual stage position (not motor position)
Substrate Flexibility
• Up to mm thick.
• Si, Glass, Ceramic, Flexible.
• 2″ to 8″ Robot Load.
• Round, Square, Irregular. - Exposure Modes
Soft, Pressure, Vacuum Contact and Proximity Printing Modes - Print Resolution
Proximity 4 um at 20um gap
Soft Contact 3 um
Hard Contact 2 um
Vacuum Contact 1 um
Note: Achievable resolution depends on many process conditions including wafer
m flatness, resist type and therefore might vary according to the actual process. - Alignment Accuracy (+/- 3 sigma)
Top Side Alignment (TSA) (Contact) 0.5um (Proximity) 0.5um
Backside Alignment (BSA) (Contact) 0.75um (Proximity) 0.75um - Alignment Stage
Alignment Travel X-Y and Theta Motorized with automatic re-centering
X-Y Movement +/- 4mm, 50nm resolution
Theta Rotation Range +/-4 degrees, 4×10-4 °/μ resolution
Mask/ Wafer separation 0 – 1000um with 1um resolution - Microscope Travel Range
R/L Microscope Travel in X ± 22mm to 150mm
R/L Microscope Travel in Y +12.7mm to – 88mm - Top Side Microscopes
UHD Quadcam Microscope
5x Objectives with Digital Zoom, Optional 2x or 7.5 x - Electronics / Connectivity
Windows 11 64-bit
SECS / GEM, OCR, Barcode
Local / Remote Diagnostics - UV-LED Exposure Optics
Standard UV LED Optics
Polychromatic (GHI spectrum), recipe set 20 – 100%, Uniformity ±3%.
o Intensity Output Range
• Up to 27 mW/cm2 I – Line
• Up to 68 m W/cm 2 Broadband
Standard UV LED Optics
Polychromatic (GHI spectrum), recipe set 20 – 100%, Uniformity ±3%.
o Intensity Output Range
• Up to 70 mW/cm2, I – Line.
• Up to 160 mW/cm2, Broadband. Standard UV LED Optics
High Power I-line unit, recipe set 20 – 100%, Uniformity ±3%
o Intensity Output Range
• Up to 138 mW/cm2, I – Line.
