AML Wafer Bonder
The AML wafer bonder system provided by NxQ provides anodic, eutectic, direct (High & Low Temperature) glass frit, adhesive, solder & thermo-compression wafer bonding, providing alignment and bonding in a single machine.
The AML wafer bonder system provided by NxQ provides anodic, eutectic, direct (High & Low Temperature) glass frit, adhesive, solder & thermo-compression wafer bonding, providing alignment and bonding in a single machine.
155 E. Main Avenue Suite #170 Morgan Hill, CA 95037 U.S.A.
