Onshoring Advanced Packaging and Assembly 2024 Workshop

Neutronix Quintel to Attend Onshoring Advanced Packaging and Assembly 2024 Workshop

Neutronix Quintel is participating in the Onshoring Advanced Packaging and Assembly 2024 workshop, hosted by the International Microelectronics Assembly and Packaging Society (IMAPS) and IPC. 

What: Onshoring Advanced Packaging and Assembly 2024 Workshop
When: April 29 – May 1, 2024
Where: The Westin Arlington, 801 North Glebe Road, Arlington, VA 22203, United States

Event Overview:
The workshop, organized by IMAPS and IPC, aims to facilitate discussions on strategies for enhancing onshoring efforts in advanced packaging and assembly within the microelectronics industry. Government agencies, the Defense Industrial Base (DIB), and advanced packaging providers will convene to explore critical topics such as domestic supply chain resilience and national security.

Agenda Highlights:

  • Two days of focused sessions, keynote presentations, and panel discussions
  • Networking opportunities with sponsors and tabletop exhibitors
  • Briefings from government agencies including the Department of Commerce/NIST, DoD (SHIP/IBAS/Title III/Printed Circuit Board Executive Agent), DARPA, and SRC on their advanced packaging programs

At Neutronix, we’re eager to contribute to these crucial conversations and explore avenues for strengthening the microelectronic assembly and packaging supply chain. As a leading provider of semiconductor solutions, we’re committed to innovation and collaboration in the sector.

For more information about the workshop, please visit https://www.ipc.org/event/onshoring-advanced-packaging-and-assembly-2024

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