International Microelectronics Assembly & Packaging Society

We are thrilled to announce the 20th Annual Device Packaging Conference (DPC 2024), organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

What: 20th Annual Device Packaging Conference (DPC 2024)
When: March 18-21, 2024
Where: WeKoPa Resort and Conference Center

This international event will be co-located with the Workshop on Advanced Packaging for Medical Microelectronics (March 21-22). DPC 2024 serves as a major forum for the exchange of knowledge, offering technical insights, social engagements, and networking opportunities.

Join us at the WeKoPa Resort and Conference Center for an enriching experience, connecting with experts from various fields within industry and academia. This conference is tailored for scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

For further details, visit https://imaps.org/page/Device-Packaging

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